GLOSSARY OF TERMS
[ TERMS USED IN PLASMA PHYSICS ]
In the following please find a glossary of the most important terms in the field of plasma physics.
Note: In order to find words you are looking for, please use the search function of your browser (press STRG+F at the same time and enter your searchword) or simply click on the letters of the alphabet below to find the corresponding terms beginning with this letter.
Index
13,56 MHz ,
2,45 GHz ,
27,12 MHz ,
40 kHz ,
ABS ,
Acid ,
Acrylic ,
Acrylonitrile-Butadiene-Styrene - ABS ,
Activation ,
Active species ,
Adhesion ,
Adhesion promoters ,
Adhesive Strength ,
Adsorption ,
AFM ,
Aluminium ,
Aluminium Oxide ,
Anisotropic ,
Anode ,
Antiadhesive layers ,
Applications ,
Arc ,
Areas of application ,
Argon (Ar) ,
Auger effect ,
Automotive engineering ,
Barrel reactor ,
Barrelling ,
Barrier layers ,
Base Material for Printed Circuit Boards ,
BGA ,
Bias voltage ,
Binding energy ,
Bonding ,
Case hardening ,
Cathode ,
Chamber ,
Charge-exchange collision ,
Chemical etching ,
Chemisorption ,
Chromium ,
Circuit board ,
Cleaning ,
Cleaning aluminium ,
Cleaning copper ,
Coating ,
Coating adhesion ,
Coating Aluminium ,
Coating thickness ,
Components of plasma systems ,
Contact angle ,
Copper ,
Corona discharge ,
Corrosion ,
Corrosion Protection ,
Cratering ,
Cross-cut tape test ,
CVD ,
Degreasing ,
Desmear process ,
Desorption ,
Direct current source / alternating voltage source ,
DLC layers ,
Downstream reactor ,
Duplex surface engineering ,
Electrode ,
Electron ,
Electron volt ,
Electronegative plasma ,
Electropositive plasma ,
Epilam coats ,
Epitaxy ,
Epoxy Resins ,
ESCA ,
Etching ,
Etching mask ,
Etching of glass ,
Etching of PCBs ,
Ethylene-Propylene-(Diene)-Copolymer - EP(D)M ,
Finish ,
Fluorescent tube ,
Fluxing agent ,
Foil treatment ,
Funktionalization ,
Gallium Arsenide ,
Gas discharge ,
GDOS ,
Generator ,
Glass ,
Glow ,
Hard coatings ,
HMDSO ,
Hydrogen ,
Hydrophilic layers ,
Hydrophilicity ,
Hydrophobic ,
Hydrophobic layers ,
IC ,
Impregnation ,
Induction ,
Inductive plasma ,
Industrial pretreatment ,
Interfacial Tension ,
Ion ,
Ion Beam Etching ,
Ion implantation ,
Ion measuring sensor ,
Ion plating ,
Ionization ,
Isotope ,
Isotropic ,
Langmuir probe ,
Lead frame ,
LIGA process ,
Lightning discharge ,
Liquid Crystal Polymers - LCP ,
Lithography ,
Low pressure plasma ,
Magazine ,
Magnetic mirror ,
Magnetron ,
Mask ,
Mean free path length ,
MEMS ,
Metal ,
MFC / Mass-Flow-Controller ,
Microsandblasting ,
Microwave technology ,
Modification ,
Nanoparticles ,
Neon light tube ,
Neutron ,
Non neutral plasmas ,
Nucleon ,
OAUGDP ,
Optical coating ,
Overetching ,
Oxygen ,
PACVD ,
Painting ,
Painting of plastics ,
Parallel plate reactor ,
Passivating Layer ,
PCB ,
PE (Polyethylene) ,
Perfluoralkoxy - PFA ,
Permeation ,
Photon ,
Physical etching ,
Physisorption ,
Pirani sensor ,
Plasma ,
Plasma asher ,
Plasma boriding ,
Plasma carbonitriding ,
Plasma carburising ,
Plasma chemistry ,
Plasma cleaner ,
Plasma colour ,
Plasma diffusion ,
Plasma etcher ,
Plasma etching ,
Plasma hardening ,
Plasma nitriding ,
Plasma nitrocarburising ,
Plasma polymerisation ,
Plasma spray coating ,
Plasma technology ,
Plasmaasher ,
Plasmacleaner ,
Plasmaetcher ,
Plastic ,
Plastic coating ,
Polyacrylonitrile - PAN ,
Polyamide (PA) ,
Polyamide - PA ,
Polyamide Thermoplastic Elastomer – PA-TPE ,
Polybutene - PB ,
Polybutylene Terephthalat ,
Polycarbonate (PC) ,
Polycarbonate - PC ,
Polyethylene - PE ,
Polyethylene terephthalat (PET) ,
Polyethylene Terepthalate - PET ,
Polymerization ,
Polymethacrylimide - PMI ,
Polymethyl Methacrylate - PMMA ,
Polyolefins ,
Polyoxymethylen (POM) ,
Polyphenylene Sulphide - PPS ,
Polypropylene (PP) ,
Polypropylene - PP ,
Polystyrene (PS) ,
Polytetrafluoroethylene - PTFE ,
Polytetrafluourethylene (PTFE) ,
Polyvinylchloride - PVC ,
Polyvinylfluoride - PVF ,
Positive column ,
Preparation before sticking ,
Pretreatment ,
Principle of plasma process ,
Printed circuit board ,
Printing Process ,
Process gas ,
Proton ,
PUR PU Flexible Foam ,
PUR PU Rigid Foam ,
PVC ,
PVC-U - Rigid PVC ,
Reactive ion plating (RIP) ,
Recipient ,
Release agent residues ,
Release agents ,
RIE ,
Roots pump ,
Rotary drum ,
Rotary vane pump ,
SEM ,
Sheath ,
Silicon ,
Silicon carbide ,
Silicon dioxide ,
Silicon nitride ,
Silicone ,
Silver ,
SIMS ,
Small flanges ,
Soldering ,
Sputtering ,
Stainless steel ,
Sticking ,
Sticking in automotive engineering ,
Sticking of glass ,
Sticking PE ,
Sulfur hexafluoride ,
Surface energy ,
Surface oxide ,
Surface radical ,
Surface technology ,
Tensides ,
Tesla ,
Test ink ,
Tetrafluoromethane ,
Thornton diagram ,
Titanium carbide ,
Titanium nitride ,
TOF-SIMS ,
Trench ,
Turbomolecular pump ,
Ultraviolet ,
UV radiation ,
Vapour Deposition ,
Wet Method ,
Wetting ,
Wetting Angle Adjustment ,
Wetting Test ,
