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diener electronic : glossary of terms : Plasma Oberflächentechnologie, Plasmaanlagen, Plasmabeam
diener electronic  |  Plasma-Surface-Technology Plasma Plasma systems Surface-Technology
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In the following please find a glossary of the most important terms in the field of plasma physics.

Note: In order to find words you are looking for, please use the search function of your browser (press STRG+F at the same time and enter your searchword) or simply click on the letters of the alphabet below to find the corresponding terms beginning with this letter.


1 2 4 A B C D E F G H I K L M N O P R S T U V W

 1  13,56 MHz,
 2  2,45 GHz, 27,12 MHz,
 4  40 kHz,
 A  ABS, Acid, Acrylic, Acrylonitrile-Butadiene-Styrene - ABS, Activation, Active species, Adhesion, Adhesion promoters, Adhesive Strength, Adsorption, AFM, Aluminium, Aluminium Oxide, Anisotropic, Anode, Antiadhesive layers, Applications, Arc, Areas of application, Argon (Ar), Auger effect, Automotive engineering,
 B  Barrel reactor, Barrelling, Barrier layers, Base Material for Printed Circuit Boards, BGA, Bias voltage, Binding energy, Bonding,
 C  Case hardening, Cathode, Chamber, Charge-exchange collision, Chemical etching, Chemisorption, Chromium, Circuit board, Cleaning, Cleaning aluminium, Cleaning copper, Coating, Coating adhesion, Coating Aluminium, Coating thickness, Components of plasma systems, Contact angle, Copper, Corona discharge, Corrosion, Corrosion Protection, Cratering, Cross-cut tape test, CVD,
 D  Degreasing, Desmear process, Desorption, Direct current source / alternating voltage source, DLC layers, Downstream reactor, Duplex surface engineering,
 E  Electrode, Electron, Electron volt, Electronegative plasma, Electropositive plasma, Epilam coats, Epitaxy, Epoxy Resins, ESCA, Etching, Etching mask, Etching of glass, Etching of PCBs, Ethylene-Propylene-(Diene)-Copolymer - EP(D)M,
 F  Finish, Fluorescent tube, Fluxing agent, Foil treatment, Funktionalization,
 G  Gallium Arsenide, Gas discharge, GDOS, Generator, Glass, Glow,
 H  Hard coatings, HMDSO, Hydrogen, Hydrophilic layers, Hydrophilicity, Hydrophobic, Hydrophobic layers,
 I  IC, Impregnation, Induction, Inductive plasma, Industrial pretreatment, Interfacial Tension, Ion, Ion Beam Etching, Ion implantation, Ion measuring sensor, Ion plating, Ionization, Isotope, Isotropic,
 L  Langmuir probe, Lead frame, LIGA process, Lightning discharge, Liquid Crystal Polymers - LCP, Lithography, Low pressure plasma,
 M  Magazine, Magnetic mirror, Magnetron, Mask, Mean free path length, MEMS, Metal, MFC / Mass-Flow-Controller, Microsandblasting, Microwave technology, Modification,
 N  Nanoparticles, Neon light tube, Neutron, Non neutral plasmas, Nucleon,
 O  OAUGDP, Optical coating, Overetching, Oxygen,
 P  PACVD, Painting, Painting of plastics, Parallel plate reactor, Passivating Layer, PCB, PE (Polyethylene), Perfluoralkoxy - PFA, Permeation, Photon, Physical etching, Physisorption, Pirani sensor, Plasma, Plasma asher, Plasma boriding, Plasma carbonitriding, Plasma carburising, Plasma chemistry, Plasma cleaner, Plasma colour, Plasma diffusion, Plasma etcher, Plasma etching, Plasma hardening, Plasma nitriding, Plasma nitrocarburising, Plasma polymerisation, Plasma spray coating, Plasma technology, Plasmaasher, Plasmacleaner, Plasmaetcher, Plastic, Plastic coating, Polyacrylonitrile - PAN, Polyamide (PA), Polyamide - PA, Polyamide Thermoplastic Elastomer – PA-TPE, Polybutene - PB, Polybutylene Terephthalat, Polycarbonate (PC), Polycarbonate - PC, Polyethylene - PE, Polyethylene terephthalat (PET), Polyethylene Terepthalate - PET, Polymerization, Polymethacrylimide - PMI, Polymethyl Methacrylate - PMMA, Polyolefins, Polyoxymethylen (POM), Polyphenylene Sulphide - PPS, Polypropylene (PP), Polypropylene - PP, Polystyrene (PS), Polytetrafluoroethylene - PTFE, Polytetrafluourethylene (PTFE), Polyvinylchloride - PVC, Polyvinylfluoride - PVF, Positive column, Preparation before sticking, Pretreatment, Principle of plasma process, Printed circuit board, Printing Process, Process gas, Proton, PUR PU Flexible Foam, PUR PU Rigid Foam, PVC, PVC-U - Rigid PVC,
 R  Reactive ion plating (RIP), Recipient, Release agent residues, Release agents, RIE, Roots pump, Rotary drum, Rotary vane pump,
 S  SEM, Sheath, Silicon, Silicon carbide, Silicon dioxide, Silicon nitride, Silicone, Silver, SIMS, Small flanges, Soldering, Sputtering, Stainless steel, Sticking, Sticking in automotive engineering, Sticking of glass, Sticking PE, Sulfur hexafluoride, Surface energy, Surface oxide, Surface radical, Surface technology,
 T  Tensides, Tesla, Test ink, Tetrafluoromethane, Thornton diagram, Titanium carbide, Titanium nitride, TOF-SIMS, Trench, Turbomolecular pump,
 U  Ultraviolet, UV radiation,
 V  Vapour Deposition,
 W  Wet Method, Wetting, Wetting Angle Adjustment, Wetting Test,
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