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Tetrafluoromethane
Often employed as process gas in plasma processes, in particular in etching processes. Tetrafluormethane (CF4, also designated Freon 14) is totally inert under usual conditions, but generates free fluorine atoms and CF2- and CF3-radicals when employed as plasma process gas. These radicals exert a very strong etching effect, e. g. on silicon dioxide. Mixtures from CF4 and oxygen etch five times as fast as pure oxygen.
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