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Sputtering
Designation for plasma cleaning involving the bombardment of high energy ions from a plasma onto a surface, thereby removing surface atoms. In pure sputter processes, Argon is often employed as process gas. Plasma cleaning by sputtering is also designated “micro-sandblasting”. Furthermore, sputtering is applied in thin film technology as a method for the generation of vapour phases with definite composition by bombardement of a sample of the desired material (the so-called target).
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